SI performs thermal-hydraulic analysis of components and structures, primarily to determine loadings on other components. Both steady state and transient thermal hydraulic analyses are performed using classical textbook methods, software specifically developed for the purpose, or finite element software.
The following provides brief descriptions of several typical projects undertaken in this area:
- Unsteady flow in the outlet conduit from a dam was evaluated to understand the reasons for unsteady air/water flow observed at the outlet and to show that operation at higher flow rates would not be detrimental.
- Severe wall thinning in the piping beyond a feedwater heater drain tank had been observed. Analysis was conducted to show that there was insufficient back-pressure and that two-phase flow conditions were a significant contributor to the wall thinning.
- Flow distributions were determined in the annulus region of a Boiling Water Reactor so that flow and vortex shedding loads on internal piping could be developed.
- Many analyses have been conducted to determine stratified flow level and heat transfer coefficients in piping systems where stratified flow conditions can exist.
- PWR plant thermocouple test data were evaluated to determine internal piping flow and stratification conditions that would exist during various modes of operation.
- Analysis of reactor containment pressure-temperature response was conducted to justify conducting BWR reactor pressure tests at elevated temperatures with the containment open.
- Leak rates though crack-like openings in piping and other more complex geometries have been conducted, including consideration of two-phase flow effects.
SI has proprietary and commercially available software to use in such evaluations. One of these software products allows piping system water hammer and unsteady flow loads to be determined, adding a significant new capability for use in piping system analysis. Computational fluid dynamic analysis (CFD) is conducted through arrangements with specialists in this area.
Related Technical Literature
·
For more information, contact SI.
|